PC engineering adhesive products are mainly made of epoxy resin, curing agent, inorganic filler, MS silane modified polyether, emulsion and other raw materials. The adhesive products are mainly used for sealing and repairing the gaps between the prefabricated boards, laminated plates, current injection boards, light boards, wood, aluminum and glass in PC building. Good performance, low curing shrinkage, good thixotropy, good aging resistance, good construction performance, green environmental protection and other performance characteristics, one-stop solution to the bonding and crack treatment of various types of base materials in assembly building.